Surprisingly high demand for mobile audio and smartphone power management chips caused Dialog Semiconductor (Kirchheim, Germany) to raise its guidance for FY 2009.

Dutch chip company NXP BV (Eindhoven, The Netherlands) has agreed to transfer part of its advanced CMOS intellectual property (IP) rights, 160 staff and certain engineering equipment to Virage Logic Corp. (Fremont, Calif.).

The first interoperability testing of multivendor UMTS femtocell equipment is set to take place in Sophia Antipolis, France next March to validate the 3GPP femtocell standard.

Cypress Semiconductor's groundbreaking PSoC devices and derivatives are already driving the company's growth, according to President and CEO T.J. Rodgers. Now Cypress has upped the ante with more powerful PSoCs that can tap into a much larger total market.

Japan's Elpida Memory Inc. said that two consolidated subsidiaries, Rexchip Electronics Corp. and Tera Probe Inc., returned to profitability in the September quarter.

Longtime National Semiconductor CEO Brian Halla is stepping down from his position as National's top executive, the company said. Halla will remain executive chairman of the company through next May.

A growing chorus of critics argue that Silicon Valley has become irrelevant as a far as silicon technology is concerned.

Taiwan's two major foundry vendors--TSMC and UMC--saw mixed results for the month of September, prompting analysts to worry about ''double ordering'' in the market.

At last, Intel Corp. has confirmed that it is hiring a team of 53 3G system integration engineers from Freescale's Cellular Products Group based in Toulouse, in the South of France.

Here are the top five online stories for the week beginning Sunday, Oct. 4, as ranked by EE Times readers, up to and including Friday, Oct. 9. The ranking is based on the number of reader "views" or "hits" on

A new kind of electrode material could overcome contamination problems in solid-oxide fuel cells using an auto-cleaning process that could also lower their cost.

The Open Virtual Platforms (OVP) initiative has released models of ARM processor cores supporting the v4 and v5 instruction sets. These models work with the OVP simulator and can operate at hundreds of millions of instructions per second (MIPS). The

The former and current CEOs of Qualcomm Inc. (San Diego, Calif.) -- Irwin and Paul Jacobs, respectively -- took the stage at the CTIA Wireless IT & Entertainment 2009 being held on their home turf, and entered the net neutrality

After 30 months of privately-funded development fabless VT Silicon Inc. (Atlanta, Georgia) has announced a silicon-based power amplifier capable of meeting the operating requirements of 4G wireless data transmissions. The company is planning to launch an integrated RF front-end for

The information didn't come from Intel nor did it come from Freescale but it is now official. France's Ministry of Industry stated that Intel is taking over the contracts of 53 out of the 236 employees that Freescale had said

Graphics chip vendor Nvidia has halted development of chipsets for next-generation Intel processors that feature the direct media interface bus, pending the outcome of current litigation between the two companies, Nvidia said.

Silicon germanium expert Ensphere Solutions Inc. (Santa Clara, Calif.) cranked up its complementary metal oxide semiconductor (CMOS) expertise to design a 10-Gbit/second, dual-channel optical-to-electrical and electrical-to-optical transceiver chip for Intel's Light Peak interconnection topology.

Fresco Microchip Inc. has closed a financing round totaling $10 million. The funding was by Ottawa, Canada-based Celtic House Venture Partners and Ventures West.