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9 July 2008 year (time zone GMT 00:00)  Number of sources in English: 4954
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LG Display Q2 net profit surges, faces slowdown ahead

09.07.2008 18:51    eetimes.com
South Korea's LG Display Co. Ltd.'s quarterly net profit more than trebled thanks to strong demand for flat screens, but future earnings will take a hit as the global economic downturn curbs consumer spending.


"Schizophrenic" wireless investors in slump

09.07.2008 18:51    eetimes.com
The wireless sector is down but far from out, according to an analyst from the wireless division of investment banker Rutberg & Company, LLC who described the sector as "schizophrenic."

U.S. panel focuses on China R&D

09.07.2008 18:51    eetimes.com
A congressional commission established to monitor U.S.-China economic and security issues will probe China's domestic and foreign-funded research and development during a hearing scheduled for July 16.

Qimonda speeds up GDDR5 chip production

09.07.2008 18:51    eetimes.com
In a continuing bleakly memory chip market, Qimonda hopes to gain an edge over the competition through its early adoption of GDDR5 technology for graphic memories. The upcoming transition to the buried-wordline technology shall increase the head start.


Teledyne and UCSB claim fastest DHBT MMIC

09.07.2008 18:12    compoundsemiconductor.net
The 324 GHz single stage InP amplifier is an important landmark for SWIFT, the DARPA program hoping to develop advanced imaging systems.

Intel invests in thin-film solar maker

09.07.2008 13:05    eetimes.com
Intel has invested ¬24 million (about $37.5 million) into Berlin-based solar module manufacturer Sulfurcell GmbH. The company produces monolithic solar modules that feature a high efficiency. The move is part of Intel's clean tech investment strategy.

Chemical used in chips, LCDs under fire

09.07.2008 13:05    eetimes.com
Scientists are expressing concern over a chemical widely used in the manufacture of computers and flat-screen televisions.

ST uses EVG's 300-mm tools to produce 3D TSV-based devices

09.07.2008 13:05    eetimes.com
European chipmaker STMicroelectronics NV announced it has placed a multi-million euro order of 300-mm bonding, alignment and photoresist processing tools with EV Group (St. Florian, Austria), supplier of wafer-bonding and lithography equipment.

NXP to sue researchers over Mifare chip 'hack'

09.07.2008 13:05    eetimes.com
NXP Semiconductors (Eindhoven, the Netherlands) is taking researchers at Radboud University in Nijmegen to court later this week in an attempt to stop them publishing their controversial report on the security aspects of the Mifare Classic chip, according to local

Samsung starts mass production of 128GB SSDs

09.07.2008 13:05    eetimes.com
Samsung Electronics Co. Ltd. has started volume production of its 1.8- and 2.5-inch multi-level cell (MLC)-based solid state drives (SSD) with a 128 Gigabyte (GB) storage capacity.

Italian group enters PV module market

09.07.2008 13:05    eetimes.com
Italian alternative energy group Moncada s.r.l. (Aragona, Sicily) has become the latest to order Applied Materials' SunFab Thin Film Line, and will use the gear to establish its first photovoltaic (PV) module production facility.

Cell prcessor trio extend R&D with Georgia Tech

09.07.2008 13:05    eetimes.com
IBM, Toshiba and Sony are to continue working on the Cell processor with researchers at the Georgia Tech College of Computing.

Broadcom, Qualcomm face off in hearing

09.07.2008 07:22    eetimes.com
Wireless chipmakers Broadcom and Qualcomm went before a U.S. appeals court Tuesday to argue a patent case that could result in BlackBerries and other advanced cell phones being banned for sale in the United States.

Agilent expands particle analysis portfolio

09.07.2008 00:40    eetimes.com
Agilent Technnologies has acquire another nanotech company as the instrumentation giant expands its porfolio of equipment for measuring nano-sized elements.

Memristors ready for prime time

09.07.2008 00:40    eetimes.com
Memristors, the fourth passive circuit in electronic circuit theory, have moved a step closer to prototyping with the harnessing of a substrate material that could yield a new memory device by 2009.

Video: Global Unichip races to 32-nm designs

09.07.2008 00:40    eetimes.com
Mark LaPedus, semiconductor editor from EE Times, caught up with Jim Lai, president and COO of Global Unichip Corp.

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